Job Title

Job Title : Lead Device SPICE Modelling Engineer Job Description : We are seeking a highly skilled Device SPICE Modelling Engineer to develop, validate, and optimize SPICE models for semiconductor devices. The ideal candidate will have a strong background in semiconductor device physics , compact modeling , and EDA tools , with a focus on creating accurate and efficient models for circuit simulation. Responsibilities : Develop and maintain SPICE models for various semiconductor devices, including MOSFETs, BJTs, diodes, and passive components. Extract and validate compact model parameters using electrical characterization data (e.g., DC-IV, CV, RF, and noise measurements). Collaborate with process technology teams to ensure SPICE models accurately reflect device behavior across process corners and operating conditions. Perform statistical modeling to account for process variations and mismatch effects. Conduct model validation through circuit simulations and comparison with silicon measurements. Optimize SPICE models for runtime efficiency and compatibility with EDA tools and design flows. Work on RF and high-frequency modeling for advanced devices and interconnects. Debug and resolve issues related to SPICE models in collaboration with design and verification teams. Stay updated with advancements in compact modeling techniques and EDA tools to enhance modeling capabilities. Provide detailed documentation and training materials for SPICE model usage and integration. Qualifications : Education : M.Tech/Ph.D. in Electrical Engineering, Microelectronics, or a related field. Experience : 10+ years of experience in SPICE model development and validation. Hands-on experience with EDA tools such as HSPICE, Spectre, ADS, or similar. Skills : Strong understanding of semiconductor device physics and compact modeling techniques. Proficiency in writing and understanding SPICE, OCEAN scripts. Proficiency in scripting languages like Python, Perl, or TCL for automation and data analysis. Knowledge of RF modeling and S-parameters for high-frequency applications. Familiarity with EM simulation tools and debugging techniques. Excellent problem-solving and analytical skills. Strong communication and teamwork abilities. Preferred Qualifications : Experience with process nodes ranging from 180nm to 28nm. Knowledge of machine learning techniques for device modeling. Exposure to design for manufacturability (DFM) and yield optimization. Familiarity with statistical modeling tools and methodologies.