Job Title

ResponsibilitiesResponsible for the technology and process development for the Wire Bonding/Flip Chip packaging engineering.FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill.EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing. Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.Install, buy-off and qualify the given processes and products for development, NPI and LVM.Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.Offer wide range of BOM selection to cater to different customer requirement.Execution of multiple department projects. Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.Assist in the MES, Automation of material, process and recipe controls. RequirementsA minimum relevant engineering or Science degree. Experience in leading a group or team of employees in the achievement of organizational goals. Exposure in MS office, 8D writing, DOE, SPC, FMEA, OCAP and Control Plan. Passionate in achieving what’s not possible via innovation and continuous learning.